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MIC：台湾09年第三季度智能手机IC出货量增长超过30%
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据台北的市场情报与咨询研究所（MIC）调查显示：2009年第三季度，台湾的智能手机IC出货量达到了11697.0万台，比上一季度增长30.9%，市值为6.137亿美元，比上一季度增长32.0%。在2009年第三季度，3G版苹果iPhone手机的销售远远超出预期，2009年第四季度销售额预计将达到1千万元。iPhone芯片供应商都将从中受益。此外，其他终端供应商均准备垫付采购来应付第四季度的高峰期。
Taiwan's smartphone IC shipments reached 116.97 million units in the third quarter of 2009, up 30.9% sequentially, and market value amounted to US$613.7 million, up 32.0% sequentially, according to Taipei-based Market Intelligence & Consulting Institute (MIC). In the third quarter of 2009, sales of the Apple iPhone 3GS far exceeded expectations, and sales are expected to reach 10 million in the fourth quarter of 2009. iPhone chip suppliers have benefited from this development. Furthermore, other terminal vendors made advance procurements to prepare for the peak season in the fourth quarter.
Regarding baseband and RF transceivers, CDMA (including EVDO) market volume in the third quarter reached 1.39 million units, accounting for 10.4% of the total, as several new models of HTC (Hero, Desire) were officially launched by US operators Verizon and Sprint and as the Palm Pre continued shipments. Terminal products using EDGE chips are gradually retreating from the market mainstream. However, due to shipments of the EDGE version mini 3i series, manufactured by Foxconn and aimed at the Chinese market, EDGE chip market volume grew to 562,000 units in the third quarter, and its share of the total amounted to 4.2%. HSPA share fell to 85.1%, but HSPA chip market volume still reached 11.37 million units, a new high.
As for suppliers' market shares, smartphones of Taiwan manufacturers still mainly adopt baseband and RF transceivers of Infineon, which benefited from the Apple iPhone series, and Qualcomm.
Regarding power amplifiers (PAs), Taiwan smartphone PA chip market volume in the third quarter of 2009 reached 48.59 million units. TriQuint still had the largest market share in this segment, as it is a main supplier of 2G PAs for HTC and 3G PAs for Apple.
As for application processors (APs), "Samsung is currently the largest supplier in the market, as it supplies for the Apple iPhone series models," said MIC industry analyst Edward Lin. "However, TI, which has exited from the baseband business and now focuses on AP development, has rolled out the OMAP 3430 series, which adopts the Cortex A8 architecture and features a clock speed of 1GHz. This offers processor options other than Qualcomm, enabling terminal vendors to pair together different communications systems, and it has been well received by many brand-name vendors, such as HTC, Palm etc. As a result, TI's share in the Taiwanese smartphone AP market increased in the third quarter of 2009."
Taiwan's smartphone IC shipments reached 116.97 million units in the third quarter of 2009, up 30.9% sequentially, and market value amounted to US$613.7 million, up 32.0% sequentially, according to Taipei-based Market Intelligence & Consulting Institute (MIC). In the third quarter of 2009, sales of the Apple iPhone 3GS far exceeded expectations, and sales are expected to reach 10 million in the fourth quarter of 2009. iPhone chip suppliers have benefited from this development. Furthermore, other terminal vendors made advance procurements to prepare for the peak season in the fourth quarter.
Regarding baseband and RF transceivers, CDMA (including EVDO) market volume in the third quarter reached 1.39 million units, accounting for 10.4% of the total, as several new models of HTC (Hero, Desire) were officially launched by US operators Verizon and Sprint and as the Palm Pre continued shipments. Terminal products using EDGE chips are gradually retreating from the market mainstream. However, due to shipments of the EDGE version mini 3i series, manufactured by Foxconn and aimed at the Chinese market, EDGE chip market volume grew to 562,000 units in the third quarter, and its share of the total amounted to 4.2%. HSPA share fell to 85.1%, but HSPA chip market volume still reached 11.37 million units, a new high.
As for suppliers' market shares, smartphones of Taiwan manufacturers still mainly adopt baseband and RF transceivers of Infineon, which benefited from the Apple iPhone series, and Qualcomm.
Regarding power amplifiers (PAs), Taiwan smartphone PA chip market volume in the third quarter of 2009 reached 48.59 million units. TriQuint still had the largest market share in this segment, as it is a main supplier of 2G PAs for HTC and 3G PAs for Apple.
As for application processors (APs), "Samsung is currently the largest supplier in the market, as it supplies for the Apple iPhone series models," said MIC industry analyst Edward Lin. "However, TI, which has exited from the baseband business and now focuses on AP development, has rolled out the OMAP 3430 series, which adopts the Cortex A8 architecture and features a clock speed of 1GHz. This offers processor options other than Qualcomm, enabling terminal vendors to pair together different communications systems, and it has been well received by many brand-name vendors, such as HTC, Palm etc. As a result, TI's share in the Taiwanese smartphone AP market increased in the third quarter of 2009."
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