io版图 器件的布局问题？
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画io版图时除ESD器件外，其他器件的布局有没有什么特殊要求?比如说器件的间距，求解答，万分感谢。
DDDDDDDDDDDDDDD
It depends on what type of IO you're talking.
Wire-bond (inline, stagger...) or flip-chip...? Is it a Bondpad Over Active Circuit (BOAC)?
In general, you want the signal/current from passivation openning go thru ESD first then connect to secondary ESD to input buffer or output driver.
You need to know what type of IO before you start your layout planning.
A lot of IO materials on line you can also search JDEC for more.
考虑IO的功率和PAD的要求
受教了，不过我也没有弄清楚我的io是什么类型的。看来要再查阅一些东西，万分感谢！
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