Avago Breaks Size Barrier with Wafer-Scale RF ICs

Avago Technologies has leveraged
over thirty years of experience in
RF component design to become
an instrumental driver in the
wireless revolution. Today, we have
a broad portfolio of processes and
basic technology patents for III-V
semiconductors in the wireless
marketplace.
Our innovative Wafer Scale Packaging (WSP), enhancementmode
pHEMT, CoolPAM ™ and bulk film acoustic resonator
(FBAR) technologies have set new benchmarks for
component size, low power requirements and performance.
Our WSP devices are fabricated in our Fort Collins, CO facility
using micro-electro-mechanical systems-like (MEMS-like)
techniques that result in fully functioning RFICs and filters
the size of a typical 0402 SMT. Having this key technology
in-house provides the additional benefit of quality control
through every step of the design and manufacturing process.
A key advantage of this technology is that an air cavity
is formed in each WSP device when bonding two wafers
together. This enables superior broadband RF performance
through the elimination of the parasitic capacitance and the
dielectric loading that limits high-frequency performance
in traditional plastic over-molded devices. A gasket is used
to seal each device providing an effective moisture barrier
without impacting performance. Another key advantage to
our WSP technology is the leadless packages formed which
use vias within each device to bring the connections down
to the bottom allowing standard SMT equipment to mount
and solder them to a PCB. As a result, no special equipment
is required to take advantage of this innovative technology.
WSP provides the smallest form factor available in the
market for use where size is of paramount importance within
the application. A complete lineup of WSP devices are
available from Avago Technologies including broadband,
low noise, high linearity FETs, (Low Noise Amplifiers) LNAs,
general purpose amplifiers, (Variable Gain Amplifiers) VGAs,
detectors, diodes, and filters. Each device is fully matched 50
Ohm with no additional RF matching required. These can be
seen in wireless handsets and infrastructure, military, Cable/
Satellite TV, automotive, radar, and test equipment.
Packaging has always been the “Achilles Heal” of extracting
the maximum microwave performance out of any IC
technology. Our wafer-level packaging technology provides
a viable and reliable solution to future microwave through
millimeter applications. The inherent parasitic capacitance
and inductance associated with bond wires, lead frames,
and encapsulating dielectric materials dominate the final
products high frequency performance by making the IC the
package.

good material

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