诺基亚N8的BOM成本与iPhone 4非常接近

Nokia N8's BOM costs similar to iPhone 4

by Dylan McGrath

Nokia's N8 smarphone, which features a 12-megapixel CMOS image sensor, includes chips made by Synaptics Inc., Texas Instruments Inc., Broadcom Corp., Renesas Electronics Corp., STMicroelectronics NV, ST-Ericsson SA and Murata Manufacturing Co. Ltd., according to a teardown analysis performed by market research firm iSuppli Corp.

Despite dramatic differences in the designs, the NB carrier a bill of materials (BOM) cost nearly identical to iPhone 4, according to the teardown analysis. The N8's BOM cost is $187.47, according to the teardown analysis, just 4 cents less than an iSuppli teardown found to be the BOM of the 16-Gbyte version of the iPhone 4 in June.

Andrew Rassweiler, principal analyst and teardown services manager at iSuppli, the N8's BOM is proof that Nokia is going after the touch-screen smartphone segment dominated by Apple. "Although the two phones differ markedly in key areas, including the camera and the core silicon, both are designed to hit similar production cost budgets," Rassweiler said.

Including about $9.50 to manufacture the N8, the total cost to produce the smartphone is about $196.97, iSuppli said. In the U.S., the N8 retails for $549 without a service contract.

While iPhones use conventional NAND flash, the N8 employees a slightly more expensive variant known as Embedded MultiMediaCard (eMMC), according to iSuppli's teardown. The analysis found Toshiba Corp. was the supplier of the eMMC NAND in the specific N8 examined by iSuppli, though the firm noted that memory is always supplied by multiple vendors.

The N8 examined also carried additional OneNAND memory and DDR DRAM supplied by Samsung Electronics Co. Ltd., iSuppli said. Samsung Mobile Display is the supplier of the N8's Active Matrix Organic Light Emitting Diode (AMOLED) display, the teardown found.

Other component highlights of the N8 revealed by iSuppli include:

* A touch screen controller supplied by Synaptics

* A digital baseband chip and a single-chip GPS device and audio power amplifier supplied by TI

* A mobile multimedia processor supplied by Broadcom

* A Bluetooth/wireless local area network IC supplied by Murrata

* AN RF transceiver, RF power management IC and power reset device, all supplied by ST-Ericsson

* A power amplifier supplied by Renesas

* Epcos AG’s front-end module

* AKM Semiconductor Inc.’s electronic compass

* A MEMS accelerometer from STMicro