灌铜问题 急求帮忙

本人Layout之后分割好地和电源层，灌铜时出现这些错误：
THERMAL RELIEF ERRORS REPORT -- FPGA2.pcb -- Fri Jan 11 21:44:01 2013
Drilled pads with Nondrilled pads with
less than 50% thermal extensionsless than 50% thermal extensions
Report of Thermal Spokes Generator.
On GND3:
(2506, 775) # = 0
(807, 454) # = 0
(3125, 750) # = 0
(418, 189) # = 0
(2199, 749) # = 0
(1178, 648) # = 0
(1295, 800) # = 0
(1256, 839) # = 0
(1763, 878) # = 0
(1646, 878) # = 0
(1295, 878) # = 0
(1295, 917) # = 0
(1256, 956) # = 0
(1685, 1034) # = 0
(1295, 1034) # = 0
(1646, 1073) # = 0
(1295, 1151) # = 0
(1490, 1231) # = 0
Total Drilled pads: 18 Total Nondrilled pads:0
Report of Violating Thermal Spokes Remover.
On GND3:
(1373, 1151) # = 0
(1490, 1151) # = 0
(1529, 1151) # = 0
(1568, 1151) # = 0
(1373, 1307) # = 0
On Power:
(2086, 1220) # = 0
(2334, 760) # = 0
(1178, 683) # = 0
(1139, 683) # = 0
(1728, 882) # = 0
(1143, 761) # = 1
(1218, 1181) # = 0
Total Drilled pads: 12 Total Nondrilled pads:0
不知道 这是什么问题，如何解决？

GND不完整