pour问题

在铺铜时出现错误，提示:
“ THERMAL RELIEF ERRORS REPORT -- TEST.pcb -- Sun Feb 07 22:40:36 2010
Drilled pads with Nondrilled pads with
less than 25% thermal extensionsless than 25% thermal extensions
Report of Thermal Spokes Generator.
On Top:
U2.7(2.1, 7.5) # = 0
U2.6(18.6, 7.5) # = 0
SW2.5 (13.9, 28.3) # = 0
EC6.1 (49.385, 28.38817) # = 0
EC7.1 (46.189, 28.48717) # = 0
SW1.5 (43.5, 28.2) # = 0
D2.A(23.2, 3.65) # = 0
R17.2 (15.8626, 16.6) # = 0
C3.2(4.2626, 22.55) # = 0
SW2.4 (27, 28.3) # = 0
Total Drilled pads:5 Total Nondrilled pads:5”
tools/options/thermal的设置如下：


怎样解决？！请高手指教

你把drill pads设置成 flood over应该就行了吧

你把drill pads设置成 flood over应该就行了吧试过了，不行

每个SMD的焊盘都拉线出来打GND过孔

我的是单面板，不可以有过孔吧，如此又该怎样？！

先把GND主干连接好，就是说所有的GND都应该有连线，然后再视需要灌铜。