PCB layout Check items

牐1,synchronizationbetweenschematicandPCBlayout.
牐爋pentheschematicandPCBlayout,usetoolsmenu,comparethem,
牐燾heckresultmustbenodifferencesfound.
牐燭hepurposeistoinsureschematicandPCBlayoutareuniform.
牐2,clearancecheck
牐燤inimumclearance>=0.15mm,
牐燜orbondingPCB,minimumclearance>=0.1mm;
牐燘ytheway,whenyouchecktheclearance,youshouldchecksamenet,settingup
牐爈ikethat,viatovia,>=0.15mm;SMStovia,>=0.15mm;theothersitems,0mm;
牐3,connectivitycheck
牐燭hisiteminsureyourlayoutjobhavebeenfinished
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牐4, Gerber files check
牐燼, silkscreen a), add silkscreen around the pads of all inserted components ,especially E-cap and transistor ; b),silkscreen diagram must be clear , one reference designator must be homologous to one component to avoid SMD assembly error. c),all silkscreen must not be on pads.
牐燽, route check whether exist short circuit, no flood copper area; c, solder mask check ant test point solder mask , usually there is no solder mask for vias;
牐燿, drill drawing check the hole dimension , insure all screw holes, socket holes dimensions are same as tooling drawing.
牐5,Hi-Pot check
牐燼, screw hole section insure clearance of all copper , traces , pads, vias away from screw edge >=2mm; b, charger section insure clearance of charger circuit section away from others >=4mm;
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牐6, P/N check
牐燙heck PCB P/N, including P/N , REV., description , PCB material, thickness,
牐爌anel quality.
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牐7, manufacturable check
牐燚istance of all traces , copper , pads away from PCB edge >=0.5mm;
牐燚istance of all holes’ edge away from PCB edge >= thickness of the PCB;
牐燰ia hole diameter >=0.2mm;
牐燤inimum trace width >=0.15mm,for bonding PCB , minimum trace width
牐>=0.1mm;
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牐8, others check items
牐燼, add copper line and solder mask at the diagonal corners of BGA component outline;
牐爐his point is requested by SMD assembly. b, add fiducial mark points if there are SMD components on the PCB. c, check the dimension , location & function of all keypads on h/s PCB.
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