High Speed USB Platform Design

1 Introduction________________________________________________________ 4
1.1 Background_________________________________________________________________4
2 Terminology________________________________________________________ 5
3 Layout Guidelines ___________________________________________________ 6
3.1 General Routing and Placement __________________________________________________6
3.2 High Speed USB Trace Spacing __________________________________________________6
3.3 High Speed USB Termination____________________________________________________7
3.4 High Speed USB Trace Length Matching ___________________________________________7
3.5 High Speed USB Trace Length Guidelines __________________________________________7
3.6 Plane Splits, Voids and Cut-Outs (Anti-Etch) ________________________________________8
3.7 Layer Stacking_______________________________________________________________8
3.8 Component Placement _________________________________________________________9
4.1 Stubs______________________________________________________________________9
4.2 Poor Routing Techniques _____________________________________________________10
5 EMI/ESD Considerations ____________________________________________ 10
5.1 EMI - Common Mode Chokes __________________________________________________10
5.2 ESD______________________________________________________________________12
6 Front Panel Solutions _______________________________________________ 13
6.1 Cables ____________________________________________________________________13
6.2 Motherboard/PCB Mating Connector_____________________________________________14
6.3 Front Panel Connector Card ____________________________________________________15
7 High Speed USB Design Checklist_____________________________________ 17
【文件名】:10610-High Speed USB Platform Design.pdf
【目　录】:

高速US设计，又用。
我做ESD保护的，了解了设计，能更好的保护啊。

貌似多我没用,不下了

正在路过

good

Good！