EMC Design for Notebook Applications

EMC Design for Notebook Applications
TABLE OF CONTENTS
1. INTRODUCTION................................................................4
2. MECHANICAL CONSTRUCTION...................................................4
2.1. USING CONDUCTIVE PLASTICS AND COATED PLASTICS.....................................4
2.2. METAL CHASSIS...............................................................6
2.3. APERTURES...................................................................8
2.4. HINGES (NOTEBOOK PC APPLICATIONS)..............................................9
2.5. SIGNAL CABLES.................................................................10
2.6. CONTACT POINTS..............................................................13
2.7. SUMMARY...................................................................16
3. GENERAL ELECTRICAL CONSIDERATIONS.......................................18
3.1. CAPACITIVE DECOUPLING........................................................18
3.2. GROUND PLANES...............................................................19
3.2.1. PCB Layout, Ground Planes and ESD............................................21
3.3. POWER PLANES AND POWER LINES.................................................22
3.4. FILTERING...................................................................23
3.5. FERRITES ....................................................................26
3.6. SUMMARY...................................................................27
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4. PanelLink APPLICATION CONSIDERATIONS....................................28
4.1. CAPACITIVE DECOUPLING........................................................28
4.2. PARALLEL DATA LINE LOADING.....................................................29
4.3. POWER DISTRIBUTION AND GROUND PLANES...........................................30
4.4. SIGNAL CABLE CONFIGURATION ....................................................31
4.5. FILTERING...................................................................33
4.6. ESD PROTECTION.............................................................33
4.7. SUMMARY...................................................................34
5. EMI TROUBLESHOOTING TIPS AND CONCLUSIONS..............................35
EMC Design for Notebook Applications.[bbs.rfeda.cn].rar (254 K)

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