Emc Design Guide For Pcb

Emc Design Guide For Pcb
EMC Design Guide for Printed Circuit Boards
TABLE OF CONTENTS
..........................................................8
PART I: PREFACE
1. INTRODUCTION.........................................................8
................................................9
PART II: GENERAL EMC
2. EMC OVERVIEW.........................................................9
2.1. The Elements.........................................................9
2.2. The Environment.......................................................10
2.3. Regulations and Standards...............................................11
2.4. Elements of EMI........................................................12
..........................................14
PART III: DESIGN APPROACH
3. OVERVIEW.............................................................14
3.1. Design Approach for Immunity (Susceptibility)...............................14
3.1.1. Design Approach for Radiated Immunity...............................14
3.1.2. Design Approach for ESD...........................................14
3.2. Design Approach for Controlling Radiated and Conducted Emissions............14
3.3. Ground System........................................................15
3.4. Wavelength and Frequency..............................................19
3.5. Frequency Domain of Digital Signals.......................................22
3.6. Radiated Emissions Predictions..........................................24
3.7. Crosstalk..............................................................28
3.7.1. Common Impedance Coupling.......................................29
3.7.2. Capacitive and inductive coupling....................................30
3.7.3. Capacitive coupling..................................................30
3.7.4. Inductive coupling.................................................33
3.8. Twisted Pair.........................................................36
3.9. Shielding..............................................................37
3.10. Resistance............................................................40
3.11. Inductance...........................................................41
..........................46
PART IV: IC RE MEASUREMENT PROCEDURE
4. SCOPE...................................................................46
4.1. Applicable Documents..................................................46
4.2. EMC Test Recommendations.............................................47
4.3. Test Procedure Applicability..............................................47
4.4. IC Emissions Reference Levels..........................................48
4.4.1. Level 1..........................................................49
4.4.2. Level 2..........................................................49
4.4.3. Level 3..........................................................49
4.4.4. Level 4..........................................................50
4.4.5. Level NR..........................................................50
4.5. Data Submission........................................................50
4.6. Radiated and Conducted Immunity.......................................50
..........................51
PART V: EMC DESIGN GUIDELINES FOR PCB
5. GENERAL................................................................51
5.1. Board Structure/Ground Systems..........................................52
5.2. Power Systems........................................................57
Frame ii of 78 Rev. A 10/01/2002
Printed copies are uncontrolled
Engineering Specification ES-3U5T-1B257-AA
EMC Design Guide for Printed Circuit Boards
5.3. Digital Circuits........................................................61
5.4. Analog Circuits.......................................................64
5.5. Communication Protocols................................................65
5.6. Shielding..............................................................65
5.7. Miscellaneous.........................................................67
..............................................69
PART VI: REQUIREMENTS
6. MANAGEMENT OF CHANGE FOR EMC......................................69
6.1. Radiated Immunity:...................................................69
6.1.1. For safety critical systems (containing one or more Class C functions).........69
6.1.2 For non-safety critical systems.......................................70
6.2. Conducted immunity:....................................................70
6.3. Electrostatic Discharge.................................................70
6.4. Conducted Emissions:...................................................71
6.4.1 CE420 Frequency domain...........................................71
6.4.2 CE410 Time Domain................................................71
..............................................72
PART VII: CHECKOFF LIST
7. CHECKOFF LIST n EMC DESIGN GUIDE FOR PCB(S)........................72
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