用CMOS工艺实现非接触式IC卡天线的集成化设计

用CMOS工艺实现非接触式IC卡天线的集成化设计

内容简介：论述了用CMOS工艺实现非接触式IC卡天线的集成化需要考虑的各个方面,建立了集成天线的模型,给出了合理的设计方案,并通过实验验证了模型和设计方案.实验结果表明,采用片上天线完全可以提供非接触式IC卡工作所需要的能量.在频率为22.5MHz、感应强度为6×10-4T的磁场中,面积为2mm×2mm的集成天线可以为10kΩ的负载提供1.225mW的能量.

Abstract：Design aspects of CMOS compatible on-chip antenna for applications of contact-less smart card are discussed.An on-chip antenna model is established and a design method is demonstrated.Experimental results show that system-on-chip integrating power reception together with other electronic functions of smart card applications is feasible.In a 6×10-4T magnetic field of 22.5MHz,an on-chip power of 1.225mW for a 10kΩ load is obtained using a 4mm2 on-chip antenna.

作者：倪昊, 徐元森,

关键词：集成天线, 非接触式IC卡, CMOS,