How do I deal with metals that intrude into multiple dielectric layers

I am working with a technology where a metal layer, intruding into the dielectric is often either A) exactly as thick as the dielectric layer or B) thicker than the dielectric layer, and intrudes into 2 or 3 dielectric layers.

I don't know how to do either of these. For a), I thought simply using intrude would work, but it does not, as the intrude is the same size as the dielectric, which is not allowed. (the intrusion depth must be strictly smaller than the dielectric thickness)

As a result, B also does not work. For B) I was told to try using vias, and mapping the top and bottom metals and then connecting them with vias. However, I don't know how to map multiple operations (in this case two intrudions and one via) to the same mask.

I think the via approach is viable. I don't think you need to use intrusion; you can define the signal layers as sheet conductors and connect them with a via, as you mentioned. (You can make the via X-Y dimensions equal to the conductor X-Y dimensions if desired.)

Hello,

I agree on the via approach. In my appnote on conformal passivation for RFIC conductors, I also map one conductor layer as a metal via so that they can pass through multiple dielectrics. This gives you exactly what you need: a thick conductor that isn't limited in thickness.

I don't see a need to map "the top and bottom metals and then connecting them with vias", because the single metal defined as a conductor via can do it all in once.

Good luck

Volker

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