Two layer metalization EM Simulation and layout generation using ADS2011.10

I want to do two layer metalization EM Simulation using ADS2011.10.

I am getting following difficulties while generating EM Simulation and layout generation of two layer metalization using ADS2011.10

1) I want to get the two layer metalization as shown in the screen shot of TWO_LAYER_LAYOUT_EXAMPLE. I am not getting as shown in the screen shot of TWO_LAYER_LAYOUT_EXAMPLE. When I opened and viewed 3D, Obtained 3D view as shown in the screen shot of 3D_View_Two_Layer_Metalization. How to get the two layer metalization 3D as shown in the screen shot of TWO_LAYER_LAYOUT_EXAMPLE.

2) In the substrate view, can we get the two layer metalization as shown in the screen shot of TWO_LAYER_LAYOUT_EXAMPLE. If so, how we can get, what modification can be done to obtain.

3) I generated the EM Simulation using ADS2011.10 for two layer metalization. I have attached the .Zap file of two layer metalization, which is shown in EM_Simulation_2_wrk.7zap. Whatever I have done for the two metalization EM simulation, is it correct. If it is wrong, what mistake I have done, can you show me.
Can you clarify above difficulties

附图/附件

TWO_LAYER_LAYOUT_EXAMPLE.png

Substrate_View.jpg

3D_View_Two_Layer_Metalization.jpg

EM_Simulation_2_wrk.7zap

You have the bottom of the board in the substrate definition set as Cover, that gives a continuous metal layer. To see double side board configuration you need to set that instead as a strip plane and map the cond2 metalization to that side of the board.

附图/附件

3D_View_Two_Layer.png

> You have the bottom of the board in the substrate definition set as Cover, that gives a continuous metal layer. To see double side board configuration you need to set that instead as a strip plane and map the cond2 metalization to that side of the board.

Where I have to go and change the options to get the double side configuration. Can you suggest me.

What about other points difficulties in the posting #1.

It's all set in the substrate definition. The one you called substrate1. Just edit that as I outlined previously to show a substrate with conductor on both sides, cond on the top and cond2 on the bottom, and not using a cover conductor.

As you said I did it. But it is showing same as like earlier. Here with I attached the .zap file. Have look on once and can you find where I am making mistake.

附图/附件

EM_Simulation_3_wrk.7zap

You have not done the substrate setup correctly. You have set cond2 as the "Bounding area layer" for the lower interface and not mapped a strip layer using cond2 to that interface.

So in the substrate editor select the lower interface and set the "Bounding area layer" back to none.

Then for this lower interface right click and set "Map Condictor Layer" and configure cond2 with all the required material and thickness properties.

Save and exit the substrate editor and it should work.

Now I am getting the 3D view of two layer metalization as I desire. Thank you for your help till I got the desired 3D view.

Here with I am attaching EM simulation of two layer metalization ".zap" file. I have EM simulated using ADS2011.10 for two layer metalization. I am new to this ADS2011.10 for two layer metalization EM simulation.

I have already done the EM Simulation for two layer metalization. I request you to check once the ".Zap" of two layer EM simulation and tell whether it is correct for all settings of EM Simulation of two layer metalization. If there is any mistake, can you point out me.

Can you help me.

附图/附件

EM_Simulation_5_wrk.7zap

I cannot advise on the specifics of the design but Via pads that are smaller than the transmission lines they are joined to, cond2 cutout too small and almost touching bottom via pads, GND pins on EM port not correctly define ("No explicit pin is assigned to minus terminal while there are no infinite ground or slot layers defined in the substrate. This port setup can lead to inaccurate or unphysical results" according to balloon help message in ADS 2015.01). There are many things that I would not do but are these 'mistakes' or just bad design choices?

FYI - you do not need two subsstrate definitions, substrate1 and substrate2. Only substrate1 is required and that is the only one used.

> {quote:title=sdgrant wrote:}{quote}
> GND pins on EM port not correctly define ("No explicit pin is assigned to minus terminal while there are no infinite ground or slot layers defined in the substrate. This port setup can lead to inaccurate or unphysical results" according to balloon help message in ADS 2015.01).
Thanks for your valuable advices for better design, you have advised me lot many issues, which can be modified in my design. I change all the bad design choices.
How we have to make EM ports to correctly define, what changes can be made to get EM ports correctly. Can you suggest it.

附图/附件

EM_Defined_Ports.jpg

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