How to Predict Package and Bondwire Effects on Your RF-Module Designs

Hello,

I am attempting to follow the procedure regarding How to Predict Package and Bondwire Effects on Your RF-Module Designs found on YouTube:

https://www.youtube.com/watch?v=sQdpX7UNayQ

ADS 2014 is used in the video.

I am using ADS 2015 and it has a different set up for nested technology and P Cells and I am having trouble getting the package and the amplifier to "line up" so that I can insert bond wires.
When I try to insert bondwires they are on the wrong layers and the boundaries for EM simulation are all wrong.

I am not sure if I am setting up the pcell correctly, the nested technology set up or the layers.

I could upload the workspace if anyone can help.

Thank you.

haper on Jul 21, 2015 6:18 PM

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