Substrate with two metals stacking

I am using ADS2014 for designing high frequency PCB. I need to stack one metal (say cond) over other metal (say cond2). What is the procedure to design such a substrate. For getting the clear understanding I am attaching the picture. Please clarify the issue. Also I need a finite ground plane for this structure. Please give the inputs.

附图/附件

Screenshot_2018-07-02_18-46-29.png

Neither Momentum of FEM support stacking metal layers. However you can use a via layer between the two metals layers to provide a connection.

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