- 易迪拓培训,专注于微波、射频、天线设计工程师的培养
一个ADS小信号模型的问题
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手上有个基于Spice的BJT GUMMEL-POON模型,是用文本文件记录的,现在要将其导入ADS中, 所知道的方法是在原理图界面的"Device_BJT"中选择相应的模型,然后输入对应的参数,但是因为参数多达几十个,而且还有封装引起的寄生参数,所以超级麻烦.可否直接自动导入?
模型如下:
***************************************************************
* SIEMENS Small Signal Semiconductors
* GUMMEL-POON MODEL CHIP PARAMETERS IN SPICE 2G6 SYNTAX
* VALID UP TO 6 GHZ
* >>> T501 <<< (CHIP) + C-E-diode
* Extracted on behalf of SIEMENS Small Signal Semiconductors by
* Institut fuer Mobil- und Satellitenfunktechnik (IMST)
* (C) 1996 SIEMENS AG
* Version 1.0 September 1996
***************************************************************
* Transistor chip:
.MODEL T501 NPN(
+ IS = 2.1024e-16 BF = 83.23 NF = 1.0405
+ VAF = 39.251 IKF = 0.16493 ISE = 1.5761e-14
+ NE = 1.7763 BR = 10.526 NR = 0.96647
+ VAR = 34.368 IKR = 0.25052 ISC = 3.7223e-17
+ NC = 1.3152 RB = 15 IRB = 0.00021215
+ RBM = 1.3491 RE = 1.9289 RC = 0.12691
+ CJE = 3.7265e-15 VJE = 0.70367 MJE = 0.37747
+ TF = 4.5899e-12 XTF = 0.3641 VTF = 0.19762
+ ITF = 0.0013364 PTF = 0 CJC = 9.6941e-14
+ VJC = 0.99532 MJC = 0.48652 XCJC = 0.08161
+ TR = 1.4935e-09 CJS= 0 VJS = 0.75
+ MJS = 0 XTB = 0 EG = 1.11
+ XTI = 3 FC = 0.99469)
* C-E-diode:
.MODEL CE1 D( IS = 2.00e-15 N = 1.02 RS=20)
***************************************************************
以下是封装参数
***************************************************************
* SIEMENS Small Signal Semiconductors
* RF-PACKAGE EQUIVALENT CIRCUIT (COMPACT SOFTWARE SYNTAX)
* VALID UP TO 6 GHZ
* >>> SOT343-3 <<< (SIEGET-PACKAGE)
* Extracted on behalf of SIEMENS Small Signal Semiconductors by
* Institut fuer Mobil- und Satellitenfunktechnik (IMST)
* (C) 1996 SIEMENS AG
* Version 1.0 September 1996
***************************************************************
*
* CCB
* (10) | | (20)
* +---------------| |----------------+
* | | | |
* LBO | LBI LCI | LCO
* B---LLL--+--LLL------B' CHIP C'---+--LLL--+--LLL---C
* (100) | (1) E' (2) | | (200)
* | | --+-- |
* | (3)| / |
* | | +-+-+ CE- |
* | | | Diode |
* | +---------+ |
* | | |
* ----- L -----
* ----- CBE L LEI ----- CCE
* | (30)| |
* +----------------+-----------------+
* |
* L
* L LEO
* |
* E
* (300)
BLK
IND 1 10 L=0.47nH ; LBI
IND 2 20 L=0.56nH ; LCI
IND 3 30 L=0.23nH ; LEI
CAP 10 20 C=6.9fF ; CCB
CAP 20 30 C=134fF ; CCE
CAP 30 10 C=136fF ; CBE
IND 10 100 L=0.53nH ; LBO
IND 20 200 L=0.58nH ; LCO
IND 30 300 L=0.05nH ; LEO
PACK: 6POR 1 2 3 100 200 300 ; B' C' E' B C E
END
***************************************************************
* PACK = NAME OF PACKAGE BLOCK
* 1 = BASE OF CHIP
* 2 = COLLECTOR OF CHIP
* 3 = EMITTER OF CHIP
* 100 = BASE OF COMPLETE TRANSISTOR IN PACKAGE
* 200 = COLLECTOR OF COMPLETE TRANSISTOR IN PACKAGE
* 300 = EMITTER OF COMPLETE TRANSISTOR IN PACKAGE
* + GUMMEL-POON NONLINEAR TRANSISTOR MODEL MUST BE ADDED
* TO NODE NO. 1(B), 2(C) and 3(E)
* + DIODE-MODEL CAN BE ADDED TO NODE NO. 2(K) and 3(A)
***************************************************************
模型如下:
***************************************************************
* SIEMENS Small Signal Semiconductors
* GUMMEL-POON MODEL CHIP PARAMETERS IN SPICE 2G6 SYNTAX
* VALID UP TO 6 GHZ
* >>> T501 <<< (CHIP) + C-E-diode
* Extracted on behalf of SIEMENS Small Signal Semiconductors by
* Institut fuer Mobil- und Satellitenfunktechnik (IMST)
* (C) 1996 SIEMENS AG
* Version 1.0 September 1996
***************************************************************
* Transistor chip:
.MODEL T501 NPN(
+ IS = 2.1024e-16 BF = 83.23 NF = 1.0405
+ VAF = 39.251 IKF = 0.16493 ISE = 1.5761e-14
+ NE = 1.7763 BR = 10.526 NR = 0.96647
+ VAR = 34.368 IKR = 0.25052 ISC = 3.7223e-17
+ NC = 1.3152 RB = 15 IRB = 0.00021215
+ RBM = 1.3491 RE = 1.9289 RC = 0.12691
+ CJE = 3.7265e-15 VJE = 0.70367 MJE = 0.37747
+ TF = 4.5899e-12 XTF = 0.3641 VTF = 0.19762
+ ITF = 0.0013364 PTF = 0 CJC = 9.6941e-14
+ VJC = 0.99532 MJC = 0.48652 XCJC = 0.08161
+ TR = 1.4935e-09 CJS= 0 VJS = 0.75
+ MJS = 0 XTB = 0 EG = 1.11
+ XTI = 3 FC = 0.99469)
* C-E-diode:
.MODEL CE1 D( IS = 2.00e-15 N = 1.02 RS=20)
***************************************************************
以下是封装参数
***************************************************************
* SIEMENS Small Signal Semiconductors
* RF-PACKAGE EQUIVALENT CIRCUIT (COMPACT SOFTWARE SYNTAX)
* VALID UP TO 6 GHZ
* >>> SOT343-3 <<< (SIEGET-PACKAGE)
* Extracted on behalf of SIEMENS Small Signal Semiconductors by
* Institut fuer Mobil- und Satellitenfunktechnik (IMST)
* (C) 1996 SIEMENS AG
* Version 1.0 September 1996
***************************************************************
*
* CCB
* (10) | | (20)
* +---------------| |----------------+
* | | | |
* LBO | LBI LCI | LCO
* B---LLL--+--LLL------B' CHIP C'---+--LLL--+--LLL---C
* (100) | (1) E' (2) | | (200)
* | | --+-- |
* | (3)| / |
* | | +-+-+ CE- |
* | | | Diode |
* | +---------+ |
* | | |
* ----- L -----
* ----- CBE L LEI ----- CCE
* | (30)| |
* +----------------+-----------------+
* |
* L
* L LEO
* |
* E
* (300)
BLK
IND 1 10 L=0.47nH ; LBI
IND 2 20 L=0.56nH ; LCI
IND 3 30 L=0.23nH ; LEI
CAP 10 20 C=6.9fF ; CCB
CAP 20 30 C=134fF ; CCE
CAP 30 10 C=136fF ; CBE
IND 10 100 L=0.53nH ; LBO
IND 20 200 L=0.58nH ; LCO
IND 30 300 L=0.05nH ; LEO
PACK: 6POR 1 2 3 100 200 300 ; B' C' E' B C E
END
***************************************************************
* PACK = NAME OF PACKAGE BLOCK
* 1 = BASE OF CHIP
* 2 = COLLECTOR OF CHIP
* 3 = EMITTER OF CHIP
* 100 = BASE OF COMPLETE TRANSISTOR IN PACKAGE
* 200 = COLLECTOR OF COMPLETE TRANSISTOR IN PACKAGE
* 300 = EMITTER OF COMPLETE TRANSISTOR IN PACKAGE
* + GUMMEL-POON NONLINEAR TRANSISTOR MODEL MUST BE ADDED
* TO NODE NO. 1(B), 2(C) and 3(E)
* + DIODE-MODEL CAN BE ADDED TO NODE NO. 2(K) and 3(A)
***************************************************************
怎么安装ADS软件,能教我一下吗?
我装完后出来一个LICENSE server machine is down or responding
FLEXnet Licensing error:-97,7. System Error:11001 WinSock:Host not found (HOST_NOT_FOUND)
Tools/IC-CAP Import/BJT Devices/GUMMEL-POON...希望有用:)
谢谢你!刚才试了一下,还是不行,它只支持"mps"文件,但是我的事"txt"文件.
是不是改下扩展名就可以了
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