HFSS和CST应用于过孔模型的协同仿真研究

HFSS和CST应用于过孔模型的协同仿真研究
内容简介：基于过孔的实际参数，利用HFSS和CST建立了六层高速PCB板过孔的全波分析理论模型。在1-10GHz频段，研究过孔的四个重要参数，包括孔径及内外径的差值比、过孔长度、基板介电常数等，对信号传输性能的影响；并选择射频常用频点，f=5GHz进行了仿真验证，得到了优化信号完整性的设计参数：内径不大于10rail，外径不大于25mil，过孔长度小于55rail，内外径差值越大越好，比值优化为l：2．3。仿真结果表明：理论模型是实际有效的，并且优化的设计参数可以保证过孔的阻抗连续性和较小的反射损耗、插入损耗。这对高频PCB板的设计有很好的指导意义。
Abstract：Co-simulation of the theoretical via model is presented by using HFSS and CST, with the sweep frequency ranges 1- 10 GHz. The impact of structure parameters on signal integrity is analysised, including the via diameter, the ratio of inner and outer diameter, the via length and the relative permittivity of substrate. We select f=5 GHz as the RF validation frequency. The simulation results show that inner radius using no more than 10 mil, outer radius using no more than 25 mil and through-hole length using less than 55 mil can guarantee the continuity of impedance and cost lower insertion loss. The optimal ratio between inner diameter and outer diameter is 1 to 2.3. Above all, the model is practical and effective. It＇s a good guidance for the design of high-frequency Printed Circuit Board
作者：彭文均
关键词：过孔建模, 协同仿真, 信号完整性, 结构参数, PCB设计