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AD6.7的增加功能说明1
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© 2006 Altium Limited Page 1 of 10
Build 6.7.0.9346
PCB
1. IPC Footprint Wizard now supports the following:
§ Molded Components Capacitor,
Inductor and Diode.
§ MELF components diodes
and resistors.
§ Precision wire wound inductors.
§ SOT 89 packages.
§ Dual Flat Pack (CFP) packages.
§ QFN packages with dual rows of pads equivalent to National Semiconductor's 128pad
laminated CSP package.
2. Fixed rare crash on PCB when OLD API used to access to Rules.
3. Fixed PADS importer Keepout
objects: Fix keepout object translation from PADS PCB ASCII
to bring in using the correct layer. If the keepout object was set on "All Layer" in PADS, it will
be put on a "keepout" layer in Altium Designer otherwise it will use the specific keepout layer.
In the past, Altium Designer always puts the keepout objects on the "keepout" layer.
4. Enhance the PADS importer when translating PADS copper pour to Altium Designer copper
pour. In the past, it only brings in the original copper pour outlines. It is now enhanced to
also bring in the hatch outlines.
5. Fixed PADS Importer Polygon
objects: Fixed the PADS importer to correctly translate the
polygon shape.
6. Layer stackup flipping in embedded board arrays has been improved. The signal and plane
layers in the layer stack will be flipped together this will possibly allow you to flip a signal layer
against a plane layer. This also allows you to have different layer types on the same layer on
the embedded board array. The keyboard handling in FromTo
editor has been improved and
we have added a new column Topology for Nets grid and Routed for FromTo
grid.
7. The IPC Footprint Wizard QFN generator now supports: LLP components with Power and
Ground bars.
8. The IPC Footprint Wizard SOIC generator now supports SOIC components with exposed
thermal pad.
9. Generating one mid layer in a PCB panel could generate multiple Gerber files: Now when
generating only one mid layer from a PCB panel containing multiple embedded board arrays
only one Gerber file will be generated.
10. PCB Layer tabs have been significantly improved. It is now possible to optionally use short
layer names (Gerber Extensions) and display the layer color on the tab. From a right mouse
click popup menu on the tabs, it is possible to access other layer related tasks such as
highlight, show, hide, manage layer sets, layer stackup and drill pair.
11. A new interactive length tuning feature has been added to PCB. This provides a convenient
way of adding addition length to existing routed traces. The style of the pattern used to add
length is controllable and feedback is provided against any applicable length related rules. It is
also possible to manually enter a target length.
Altium Designer 6.7
© 2006 Altium Limited Page 2 of 10
12. DrillType keyword should no longer be accessible via the Filter Panel.
13. The IPC Footprint Wizard now has a batch mode that can read packages from input files (.xls
and .csv formats), and generate footprints from this data automatically. Package input file
templates can be found in the Templates folder in the installation directory.
14. When editing polygon vertices the cursor will no longer snap to itself allowing the expected
movement on the current snap grid.
15. Multilayer pad clearances now calculated correctly against SMD pads.
16. A bug in the library reports has been fixed. The footprints are now visible in a library report if
transparent layers are on in PCB display preferences.
17. The IPC Footprint Wizard incorrect footprint description and incorrect density level bug have
been corrected.
18. The Gerber extension / ODB++ layer names in the Gerber / ODB++ Setup dialog will now
appear in the order and with the names with which the respective layers will be generated.
These names should match exactly the layer names and order that will be shown when the
CAM data is loaded in CAMtastic.
19. Importing a DXF/DWG file into the PCB editor has been improved. Users now have more
control over the position at which the file is located.
20. Improved usability of "Boards Layers and colors dialog". Visibility of each layer group in the
dialog can be quickly changed independently of other groups.
21. Board level libraries have been added for Altera Cyclone III devices.
22. The IPC Footprint Wizard batch mode dialog box now has 2 buttons for loading blank template
files included in the build, as well as view the template help for any of the supported package
types. An option to generate all footprints into an open and active PcbLib file and the option to
open all generated PcbLib files at the end of the batch process has been added. There is an
alert for problems with input files when they are added prior to processing.
23. The IPC Footprint Wizard interface has been improved: On the first page it indicates clearly
which component type to choose in order to create a given package.
24. A bug during the setting of the reference point for footprints created via the IPC Footprint
Wizard batch mode has now been fixed.
25. The IPC Footprint Wizard now includes a generator for Transistor Outline (DPAK)
components.
26. The IPC Footprint Wizard SOP generator now supports SOP components with exposed
thermal pad.
27. The IPC Footprint Wizard now includes a generator for Leadless Chip Carrier (LCC)
components.
28. In some cases when importing was carried out from the PCAD library the PCB Library file was
empty: This problem has been fixed.
29. A new Stackup
Compatibility Report has been added and will flag any perceived
incompatibilities between the layer stacks of the boards in embedded board array. Gerber and
ODB++ generation for embedded board arrays has been improved; now embedded boards
with different layers in their layer stacks will be exported correctly.
30. Board Level libraries have been added for Xilinx Spartan3A devices.
Build 6.7.0.9346
PCB
1. IPC Footprint Wizard now supports the following:
§ Molded Components Capacitor,
Inductor and Diode.
§ MELF components diodes
and resistors.
§ Precision wire wound inductors.
§ SOT 89 packages.
§ Dual Flat Pack (CFP) packages.
§ QFN packages with dual rows of pads equivalent to National Semiconductor's 128pad
laminated CSP package.
2. Fixed rare crash on PCB when OLD API used to access to Rules.
3. Fixed PADS importer Keepout
objects: Fix keepout object translation from PADS PCB ASCII
to bring in using the correct layer. If the keepout object was set on "All Layer" in PADS, it will
be put on a "keepout" layer in Altium Designer otherwise it will use the specific keepout layer.
In the past, Altium Designer always puts the keepout objects on the "keepout" layer.
4. Enhance the PADS importer when translating PADS copper pour to Altium Designer copper
pour. In the past, it only brings in the original copper pour outlines. It is now enhanced to
also bring in the hatch outlines.
5. Fixed PADS Importer Polygon
objects: Fixed the PADS importer to correctly translate the
polygon shape.
6. Layer stackup flipping in embedded board arrays has been improved. The signal and plane
layers in the layer stack will be flipped together this will possibly allow you to flip a signal layer
against a plane layer. This also allows you to have different layer types on the same layer on
the embedded board array. The keyboard handling in FromTo
editor has been improved and
we have added a new column Topology for Nets grid and Routed for FromTo
grid.
7. The IPC Footprint Wizard QFN generator now supports: LLP components with Power and
Ground bars.
8. The IPC Footprint Wizard SOIC generator now supports SOIC components with exposed
thermal pad.
9. Generating one mid layer in a PCB panel could generate multiple Gerber files: Now when
generating only one mid layer from a PCB panel containing multiple embedded board arrays
only one Gerber file will be generated.
10. PCB Layer tabs have been significantly improved. It is now possible to optionally use short
layer names (Gerber Extensions) and display the layer color on the tab. From a right mouse
click popup menu on the tabs, it is possible to access other layer related tasks such as
highlight, show, hide, manage layer sets, layer stackup and drill pair.
11. A new interactive length tuning feature has been added to PCB. This provides a convenient
way of adding addition length to existing routed traces. The style of the pattern used to add
length is controllable and feedback is provided against any applicable length related rules. It is
also possible to manually enter a target length.
Altium Designer 6.7
© 2006 Altium Limited Page 2 of 10
12. DrillType keyword should no longer be accessible via the Filter Panel.
13. The IPC Footprint Wizard now has a batch mode that can read packages from input files (.xls
and .csv formats), and generate footprints from this data automatically. Package input file
templates can be found in the Templates folder in the installation directory.
14. When editing polygon vertices the cursor will no longer snap to itself allowing the expected
movement on the current snap grid.
15. Multilayer pad clearances now calculated correctly against SMD pads.
16. A bug in the library reports has been fixed. The footprints are now visible in a library report if
transparent layers are on in PCB display preferences.
17. The IPC Footprint Wizard incorrect footprint description and incorrect density level bug have
been corrected.
18. The Gerber extension / ODB++ layer names in the Gerber / ODB++ Setup dialog will now
appear in the order and with the names with which the respective layers will be generated.
These names should match exactly the layer names and order that will be shown when the
CAM data is loaded in CAMtastic.
19. Importing a DXF/DWG file into the PCB editor has been improved. Users now have more
control over the position at which the file is located.
20. Improved usability of "Boards Layers and colors dialog". Visibility of each layer group in the
dialog can be quickly changed independently of other groups.
21. Board level libraries have been added for Altera Cyclone III devices.
22. The IPC Footprint Wizard batch mode dialog box now has 2 buttons for loading blank template
files included in the build, as well as view the template help for any of the supported package
types. An option to generate all footprints into an open and active PcbLib file and the option to
open all generated PcbLib files at the end of the batch process has been added. There is an
alert for problems with input files when they are added prior to processing.
23. The IPC Footprint Wizard interface has been improved: On the first page it indicates clearly
which component type to choose in order to create a given package.
24. A bug during the setting of the reference point for footprints created via the IPC Footprint
Wizard batch mode has now been fixed.
25. The IPC Footprint Wizard now includes a generator for Transistor Outline (DPAK)
components.
26. The IPC Footprint Wizard SOP generator now supports SOP components with exposed
thermal pad.
27. The IPC Footprint Wizard now includes a generator for Leadless Chip Carrier (LCC)
components.
28. In some cases when importing was carried out from the PCAD library the PCB Library file was
empty: This problem has been fixed.
29. A new Stackup
Compatibility Report has been added and will flag any perceived
incompatibilities between the layer stacks of the boards in embedded board array. Gerber and
ODB++ generation for embedded board arrays has been improved; now embedded boards
with different layers in their layer stacks will be exported correctly.
30. Board Level libraries have been added for Xilinx Spartan3A devices.
看起来吃力了,
