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IPC-4553-2005 印制电路板用浸银电镀规范
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IPC-4553
Specification for
Immersion Silver Plating
for Printed Circuit Boards
Users of this publication are encouraged to participate in the
development of future revisions.
1 SCOPE
1.1 Statement of Scope This specification sets the
requirements for the use of Immersion Silver (IAg) as a
surface finish for printed circuit boards. This specification
is intended to set requirements for IAg deposit thickness
based on performance criteria. It is intended for use by
supplier, printed circuit manufacturer, electronics manufacturing
services (EMS) and original equipment manufacturer
(OEM).
1.2 Description IAg is a thin immersion deposit over
copper. It is a multifunctional surface finish, applicable to
soldering, press fit connections and as a contact surface. It
has the potential to be suitable for aluminum wire bonding.
The immersion silver protects the underlying copper from
oxidation over its intended shelf life. Exposure to moisture
and air contaminants, such as sulfur and chlorine, may
negatively impact the useful life of the deposit. The impact
can range from a slight discoloration of the deposit to the
pads turning completely black. Proper packaging is a
requirement.
IPC-4553-2005 印制电路板用浸银电镀规范.pdf
Specification for
Immersion Silver Plating
for Printed Circuit Boards
Users of this publication are encouraged to participate in the
development of future revisions.
1 SCOPE
1.1 Statement of Scope This specification sets the
requirements for the use of Immersion Silver (IAg) as a
surface finish for printed circuit boards. This specification
is intended to set requirements for IAg deposit thickness
based on performance criteria. It is intended for use by
supplier, printed circuit manufacturer, electronics manufacturing
services (EMS) and original equipment manufacturer
(OEM).
1.2 Description IAg is a thin immersion deposit over
copper. It is a multifunctional surface finish, applicable to
soldering, press fit connections and as a contact surface. It
has the potential to be suitable for aluminum wire bonding.
The immersion silver protects the underlying copper from
oxidation over its intended shelf life. Exposure to moisture
and air contaminants, such as sulfur and chlorine, may
negatively impact the useful life of the deposit. The impact
can range from a slight discoloration of the deposit to the
pads turning completely black. Proper packaging is a
requirement.
IPC-4553-2005 印制电路板用浸银电镀规范.pdf
好东西。
好东西。
互相学习哦。
这么好的东西，怎能不要。
支持一下哦。
多谢小编！
不错，非常感谢！
学习一下，小编精神可佳
thanks 小编
不错，学习一下。
不错，学习了。努力向上。
非常感谢。
好东西。
meishenmeyong
路过，支持支持！
