allegro 错误代码表 转

代码
相关对象
说明

单一字符代码

L
Line
走线

P
Pin
元件脚

V
Via
贯穿孔

K
Keep in/out
允许区域/禁止区域

C
Component
元件层级

E
Electrical Constraint
电气约束

J
T-Junction
呈现T形的走线

I
Island Form
被Pin或Via围成的负片孤铜





错误代码前置码说明



W
Wire
与走线相关的错误

D
Design
与整个电路板相关的错误

M
Soldemask
与防焊层相关的错误





错误代码后置码说明



S
Shape/Stub
与走线层的Shape或分支相关的错误

N
Not
Allowed
与不允许的设置相关的错误

W
Width
与宽度相关的错误





双字符错误代码



BB
Bondpad to Bondpad
Bondpad之间的错误

BL
Bondpad to Line
Bondpad与Line之间的错误

BS
Bondpad to Shape
Bondpad与Shape 之间的错误

CC
Package to Package
Package之间的 Spacing 错误

Symbol Soldermask to Symbol
Soldermask零件防焊层之间的Spacing 错误

DF
Differential Pair Length Tolerance
差分对走线的长度误差过长

Differential Pair Primary Max Separation
差分对走线的主要距离太大

Differential Pair Secondary Max Separation
差分对走线的次要距离太大

Differential Pair Secondary Max Length
差分对走线的次要距离长度过长

DI
Design Constraint Negative Plane Island
负片孤铜的错误

ED
Propagation-Delay
走线的长度错误

Relative-Propagation-Delay
走线的等长错误

EL
Max Exposed Length
走线在外层（TOP&BOTTOM）的长度过长

EP
Max Net Parallelism Length-Distance Pair
已超过Net之间的平行长度

ES
Max Stub Length
走线的分支过长

ET
Electrical Topology
走线连接方式的错误

EV
Max Via Count
已超过走线使用的VIA的最大数目

EX
Max Crosstalk
已超过Crosstalk值

Max Peak Crosstalk
已超过Peak Crosstalk值

HH
Hold to Hold Spacing
钻孔之间的距离太近

HW
Diagonal Wire to Hold Spacing
斜线与钻孔之间的距离太近

Hold to Orthogonal Wire Spacing
钻孔与垂直/水平线之间的距离太近

IM
Impedance Constraint
走线的阻抗值错误

JN
T Junction Not Allowed
走线呈T形的错误

KB
Route Keepin
to Bondpad
Bondpad在Keepin之外

Route keepout
to Bondpad
Bondpad在keepout之内

Via Keepout
to
Bondpad
Bondpad在Via Keepout之内

KC
Package to Place Keepin Spacing
元件在Place Keepin之外

Package to Place Keepout Spacing
元件在Place Keepout之内

KL
Line to Route Keepin Spacing
走线在Route Keepin之外

Line to Route Keepout Spacing
走线在Route Keepout之内

KS
Shape to Route Keepin Spacing
Shape在Route Keepin之外

Shape to Route Keepout Spacing
Shape在Route Keepout之内

KV
BBVia to Route Keepin Spacing
BBVia在Route Keepin之外

BBVia to Route Keepout Spacing
BBVia在Route Keepout之内

BBVia to Via Keepout Spacing
BBVia在Via Keepout之内

Test Via to Route Keepin Spacing
Test Via在Route Keepin之外

Test Via to Route Keepout Spacing
Test Via在Route Keepout之内

Test Via to Via Keepout Spacing
Test Via在Via Keepout之内

Through Via to Route Keepin Spacing
Through Via在Route Keepin之外

Through Via to Route Keepout Spacing
Through Via在Route Keepout之内

Through Via to Via Keepout Spacing
Through Via在Via Keepout之内

LB
Min Self Crossing Loopback Length
无

LL
Line to Line Spacing
走线之间太近

LS
Line to Shape Spacing
走线与Shape 太近

LW
Min Line Width
走线的宽度太细

Min Neck Width
走线变细的宽度太细

MA

Soldermask Alignment Error Pad
Soldermask Tolerance太小

MC
Pin/Via Soldermask to Symbol Soldermask
Pad与Symbol Soldermask之间的错误

MM
Pin/Via Soldermask to Pin/Via Soldermask
Pad
Soldermask之间的错误

PB
Pin to Bondpad
Pin与Bondpad之间的错误

PL
Line to SMD Pin Spacing
走线与SMD元件脚太近

Line to Test Pin Spacing
走线与Test元件脚太近

Line to Through Pin Spacing
走线与Through元件脚太近

PP
SMD Pin to SMD Pin Spacing
SMD元件脚与SMD元件脚太近

SMD Pin to Test Pin Spacing
SMD元件脚与Test元件脚太近

Test Pin to Test Pin Spacing
Test元件脚与Test元件脚太近

Test Pin to Through Pin Spacing
Test元件脚与Through元件脚太近

Through Pin to SMD Pin Spacing
Through元件脚与SMD元件脚太近

Through Pin to Through Pin Spacing
Through元件脚与Through元件脚太近

PS
Shape to SMD Pin Spacing
Shape与SMD元件脚太近

Shape to Test Pin Spacing
Shape与Test元件脚太近

Through Pin to Shape Spacing
Through元件脚与Shape太近

PV
BBVia to SMD Pin Spacing
BBVia与SMD元件脚太近

BBVia to Test Pin Spacing
BBVia与Test元件脚太近

BBVia to Through Pin Spacing
BBVia 与Through元件脚太近

SMD Pin to Test Via Spacing
SMD Pin与Test Via太近

SMD Pin to Through Via Spacing
SMD Pin与Through Via太近

Test Pin to Test Via Spacing
Test Pin与Test Via太近

Test Pin to Through Via Spacing
Test Pin与Through Via太近

Test Via to Through Pin Spacing
Test Via与Through Pin太近

Through Pin to Through Via Spacing
Through Pin与Through Via太近

RC
Package to Hard Room
元件在其他的Room之内

RE
Min Length Route End Segment at 135Degree
无

Min Length Route End Segment at 45/90Degree
无

SB
135Degree Turn to Adjacent Crossing Distance
无

90Degree Turn to Adjacent Crossing Distance
无

SL
Min Length Wire Segment
无

Min Length Single Segment Wire
无

SN
Allow on Etch Subclass
允许在走线层上

SO
Segment Orientaion
无

BB
Bondpad to Bondpad
Bondpad之间的错误

SS
Shape to Shape
Shape之间的错误

TA
Max Turn Angle
无

VB
Via to Bondpad
Via 与Bondpad之间的错误

VG
Max BB Via Stagger Distance
同一段线的BB Via之间的距离太长

Min BB Via Gap
BB Via之间太近

Min BB Via Stagger Distance
同一段线的BB Via之间的距离太近

Pad/Pad Direct Connect
Pad 在另一个Pad 之上

VL
BB Via to Line Spacing
BB Via与走线太近

Line to Through Via Spacing
走线与Through Via太近

Line to Test Via Spacing
走线与Test Via太近

VS
BB Via to Shape Spacing
BB Via与Shape太近

Shape to Test Via Spacing
Shape 与Test Via太近

Shape to Through Via Spacing
Shape与Through Via太近

VV
BB Via to BB Via
Spacing
BB Via之间太近

BB Via to Test Via Spacing
BB Via与Test Via太近

BB Via to Through Via Spacing
BB Via与Through Via太近

Test Via to Test Via Spacing
Test Via之间太近

Test Via to Through Via Spacing
Test Via与Through Via太近

Through Via to Through Via Spacing
Through Via之间太近

WA
Min Bonding Wire Length
Bonding Wire 长度太短

WE
Min End Segment Length
无

Min Length Wire End Segment at 135Degree
无

Min Length Wire End Segment at 45/90Degree
无

WI
Max Bonding Wire Length
Bonding Wire 长度太长

WW
Diagonal Wire to Diagonal Wire Spacing
斜线之间太近

Diagonal Wire to Orthogonal Wire Spacing
斜线与垂直/水平线之间的距离太近

Orthogonal Wire to Orthogonal Wire Spacing
垂直/水平线之间的距离太近

WX
Max Number of Crossing
无

Min Distance between Crossing
无

XB
135 Degree Turn to Adjacent Crossing Distance
无

90 Degree Turn to Adjacent Crossing Distance
无

XD
Externally Determined Violation
无

XS
Crossing to Adjacent Segment Distances
无

    LZ,这些代码是DRC检查时的错误代码吗?

不错。

  xd 错误指什么，看PCB好像没什么错误啊。

小编大哥，刷屏高手！

SN如何解决?

我也遇到相同的错误，怎么解决呢