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ALLEGRO-DRC-错误代码表
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ALLEGRO-DRC-错误代码
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DRC错误代码
代码
相关对象
说明
单一字符代码
L
Line
走线
P
Pin
元件脚
V
Via
贯穿孔
K
Keep in/out
允许区域/禁止区域
C
Component
元件层级
E
Electrical Constraint
电气约束
J
T-Junction
呈现T形的走线
I
Island Form
被Pin或Via围成的负片孤铜
错误代码前置码说明
W
Wire
与走线相关的错误
D
Design
与整个电路板相关的错误
M
Soldemask
与防焊层相关的错误
错误代码后置码说明
S
Shape/Stub
与走线层的Shape或分支相关的错误
N
Not Allowed
与不允许的设置相关的错误
W
Width
与宽度相关的错误
双字符错误代码
BB
Bondpad to Bondpad
Bondpad之间的错误
BL
Bondpad to Line
Bondpad与Line之间的错误
BS
Bondpad to Shape
Bondpad与Shape 之间的错误
CC
Package to Package
Package之间的 Spacing 错误
Symbol Soldermask to Symbol
Soldermask零件防焊层之间的Spacing 错误
DF
Differential Pair Length Tolerance
差分对走线的长度误差过长
Differential Pair Primary Max Separation
差分对走线的主要距离太大
Differential Pair Secondary Max Separation
差分对走线的次要距离太大
Differential Pair Secondary Max Length
差分对走线的次要距离长度过长
DI
Design Constraint Negative Plane Island
负片孤铜的错误
ED
Propagation-Delay
走线的长度错误
Relative-Propagation-Delay
走线的等长错误
EL
Max Exposed Length
走线在外层（TOP&BOTTOM）的长度过长
EP
Max Net Parallelism Length-Distance Pair
已超过Net之间的平行长度
ES
Max Stub Length
走线的分支过长
ET
Electrical Topology
走线连接方式的错误
EV
Max Via Count
已超过走线使用的VIA的最大数目
EX
Max Crosstalk
已超过Crosstalk值
Max Peak Crosstalk
已超过Peak Crosstalk值
HH
Hold to Hold Spacing
钻孔之间的距离太近
HW
Diagonal Wire to Hold Spacing
斜线与钻孔之间的距离太近
Hold to Orthogonal Wire Spacing
钻孔与垂直/水平线之间的距离太近
IM
Impedance Constraint
走线的阻抗值错误
JN
T Junction Not Allowed
走线呈T形的错误
KB
Route Keepin to Bondpad
Bondpad在Keepin之外
Route keepout to Bondpad
Bondpad在keepout之内
Via Keepout to Bondpad
Bondpad在Via Keepout之内
KC
Package to Place Keepin Spacing
元件在Place Keepin之外
Package to Place Keepout Spacing
元件在Place Keepout之内
KL
Line to Route Keepin Spacing
走线在Route Keepin之外
Line to Route Keepout Spacing
走线在Route Keepout之内
KS
Shape to Route Keepin Spacing
Shape在Route Keepin之外
Shape to Route Keepout Spacing
Shape在Route Keepout之内
KV
BBVia to Route Keepin Spacing
BBVia在Route Keepin之外
BBVia to Route Keepout Spacing
BBVia在Route Keepout之内
BBVia to Via Keepout Spacing
BBVia在Via Keepout之内
Test Via to Route Keepin Spacing
Test Via在Route Keepin之外
Test Via to Route Keepout Spacing
Test Via在Route Keepout之内
Test Via to Via Keepout Spacing
Test Via在Via Keepout之内
Through Via to Route Keepin Spacing
Through Via在Route Keepin之外
Through Via to Route Keepout Spacing
Through Via在Route Keepout之内
Through Via to Via Keepout Spacing
Through Via在Via Keepout之内
LB
Min Self Crossing Loopback Length
无
LL
Line to Line Spacing
走线之间太近
LS
Line to Shape Spacing
走线与Shape 太近
LW
Min Line Width
走线的宽度太细
Min Neck Width
走线变细的宽度太细
MA
Soldermask Alignment Error Pad
Soldermask Tolerance太小
MC
Pin/Via Soldermask to Symbol Soldermask
Pad与Symbol Soldermask之间的错误
MM
Pin/Via Soldermask to Pin/Via Soldermask
Pad Soldermask之间的错误
PB
Pin to Bondpad
Pin与Bondpad之间的错误
PL
Line to SMD Pin Spacing
走线与SMD元件脚太近
Line to Test Pin Spacing
走线与Test元件脚太近
Line to Through Pin Spacing
走线与Through元件脚太近
PP
SMD Pin to SMD Pin Spacing
SMD元件脚与SMD元件脚太近
SMD Pin to Test Pin Spacing
SMD元件脚与Test元件脚太近
Test Pin to Test Pin Spacing
Test元件脚与Test元件脚太近
Test Pin to Through Pin Spacing
Test元件脚与Through元件脚太近
Through Pin to SMD Pin Spacing
Through元件脚与SMD元件脚太近
Through Pin to Through Pin Spacing
Through元件脚与Through元件脚太近
PS
Shape to SMD Pin Spacing
Shape与SMD元件脚太近
Shape to Test Pin Spacing
Shape与Test元件脚太近
Through Pin to Shape Spacing
Through元件脚与Shape太近
PV
BBVia to SMD Pin Spacing
BBVia与SMD元件脚太近
BBVia to Test Pin Spacing
BBVia与Test元件脚太近
BBVia to Through Pin Spacing
BBVia 与Through元件脚太近
SMD Pin to Test Via Spacing
SMD Pin与Test Via太近
SMD Pin to Through Via Spacing
SMD Pin与Through Via太近
Test Pin to Test Via Spacing
Test Pin与Test Via太近
Test Pin to Through Via Spacing
Test Pin与Through Via太近
Test Via to Through Pin Spacing
Test Via与Through Pin太近
Through Pin to Through Via Spacing
Through Pin与Through Via太近
RC
Package to Hard Room
元件在其他的Room之内
RE
Min Length Route End Segment at 135Degree
无
Min Length Route End Segment at 45/90Degree
无
SB
135Degree Turn to Adjacent Crossing Distance
无
90Degree Turn to Adjacent Crossing Distance
无
SL
Min Length Wire Segment
无
Min Length Single Segment Wire
无
SN
Allow on Etch Subclass
允许在走线层上
SO
Segment Orientaion
无
BB
Bondpad to Bondpad
Bondpad之间的错误
SS
Shape to Shape
Shape之间的错误
TA
Max Turn Angle
无
VB
Via to Bondpad
Via 与Bondpad之间的错误
VG
Max BB Via Stagger Distance
同一段线的BB Via之间的距离太长
Min BB Via Gap
BB Via之间太近
Min BB Via Stagger Distance
同一段线的BB Via之间的距离太近
Pad/Pad Direct Connect
Pad 在另一个Pad 之上
VL
BB Via to Line Spacing
BB Via与走线太近
Line to Through Via Spacing
走线与Through Via太近
Line to Test Via Spacing
走线与Test Via太近
VS
BB Via to Shape Spacing
BB Via与Shape太近
Shape to Test Via Spacing
Shape 与Test Via太近
Shape to Through Via Spacing
Shape与Through Via太近
VV
BB Via to BB Via Spacing
BB Via之间太近
BB Via to Test Via Spacing
BB Via与Test Via太近
BB Via to Through Via Spacing
BB Via与Through Via太近
Test Via to Test Via Spacing
Test Via之间太近
Test Via to Through Via Spacing
Test Via与Through Via太近
Through Via to Through Via Spacing
Through Via之间太近
WA
Min Bonding Wire Length
Bonding Wire 长度太短
WE
Min End Segment Length
无
Min Length Wire End Segment at 135Degree
无
Min Length Wire End Segment at 45/90Degree
无
WI
Max Bonding Wire Length
Bonding Wire 长度太长
WW
Diagonal Wire to Diagonal Wire Spacing
斜线之间太近
Diagonal Wire to Orthogonal Wire Spacing
斜线与垂直/水平线之间的距离太近
Orthogonal Wire to Orthogonal Wire Spacing
垂直/水平线之间的距离太近
WX
Max Number of Crossing
无
Min Distance between Crossing
无
XB
135 Degree Turn to Adjacent Crossing Distance
无
90 Degree Turn to Adjacent Crossing Distance
无
XD
Externally Determined Violation
无
XS
Crossing to Adjacent Segment Distances
无
<div __1326040128187__="ev_1264270853" js-fs2? ztag nbw-blog fc11 fc05>
DRC错误代码
代码
相关对象
说明
单一字符代码
L
Line
走线
P
Pin
元件脚
V
Via
贯穿孔
K
Keep in/out
允许区域/禁止区域
C
Component
元件层级
E
Electrical Constraint
电气约束
J
T-Junction
呈现T形的走线
I
Island Form
被Pin或Via围成的负片孤铜
错误代码前置码说明
W
Wire
与走线相关的错误
D
Design
与整个电路板相关的错误
M
Soldemask
与防焊层相关的错误
错误代码后置码说明
S
Shape/Stub
与走线层的Shape或分支相关的错误
N
Not Allowed
与不允许的设置相关的错误
W
Width
与宽度相关的错误
双字符错误代码
BB
Bondpad to Bondpad
Bondpad之间的错误
BL
Bondpad to Line
Bondpad与Line之间的错误
BS
Bondpad to Shape
Bondpad与Shape 之间的错误
CC
Package to Package
Package之间的 Spacing 错误
Symbol Soldermask to Symbol
Soldermask零件防焊层之间的Spacing 错误
DF
Differential Pair Length Tolerance
差分对走线的长度误差过长
Differential Pair Primary Max Separation
差分对走线的主要距离太大
Differential Pair Secondary Max Separation
差分对走线的次要距离太大
Differential Pair Secondary Max Length
差分对走线的次要距离长度过长
DI
Design Constraint Negative Plane Island
负片孤铜的错误
ED
Propagation-Delay
走线的长度错误
Relative-Propagation-Delay
走线的等长错误
EL
Max Exposed Length
走线在外层（TOP&BOTTOM）的长度过长
EP
Max Net Parallelism Length-Distance Pair
已超过Net之间的平行长度
ES
Max Stub Length
走线的分支过长
ET
Electrical Topology
走线连接方式的错误
EV
Max Via Count
已超过走线使用的VIA的最大数目
EX
Max Crosstalk
已超过Crosstalk值
Max Peak Crosstalk
已超过Peak Crosstalk值
HH
Hold to Hold Spacing
钻孔之间的距离太近
HW
Diagonal Wire to Hold Spacing
斜线与钻孔之间的距离太近
Hold to Orthogonal Wire Spacing
钻孔与垂直/水平线之间的距离太近
IM
Impedance Constraint
走线的阻抗值错误
JN
T Junction Not Allowed
走线呈T形的错误
KB
Route Keepin to Bondpad
Bondpad在Keepin之外
Route keepout to Bondpad
Bondpad在keepout之内
Via Keepout to Bondpad
Bondpad在Via Keepout之内
KC
Package to Place Keepin Spacing
元件在Place Keepin之外
Package to Place Keepout Spacing
元件在Place Keepout之内
KL
Line to Route Keepin Spacing
走线在Route Keepin之外
Line to Route Keepout Spacing
走线在Route Keepout之内
KS
Shape to Route Keepin Spacing
Shape在Route Keepin之外
Shape to Route Keepout Spacing
Shape在Route Keepout之内
KV
BBVia to Route Keepin Spacing
BBVia在Route Keepin之外
BBVia to Route Keepout Spacing
BBVia在Route Keepout之内
BBVia to Via Keepout Spacing
BBVia在Via Keepout之内
Test Via to Route Keepin Spacing
Test Via在Route Keepin之外
Test Via to Route Keepout Spacing
Test Via在Route Keepout之内
Test Via to Via Keepout Spacing
Test Via在Via Keepout之内
Through Via to Route Keepin Spacing
Through Via在Route Keepin之外
Through Via to Route Keepout Spacing
Through Via在Route Keepout之内
Through Via to Via Keepout Spacing
Through Via在Via Keepout之内
LB
Min Self Crossing Loopback Length
无
LL
Line to Line Spacing
走线之间太近
LS
Line to Shape Spacing
走线与Shape 太近
LW
Min Line Width
走线的宽度太细
Min Neck Width
走线变细的宽度太细
MA
Soldermask Alignment Error Pad
Soldermask Tolerance太小
MC
Pin/Via Soldermask to Symbol Soldermask
Pad与Symbol Soldermask之间的错误
MM
Pin/Via Soldermask to Pin/Via Soldermask
Pad Soldermask之间的错误
PB
Pin to Bondpad
Pin与Bondpad之间的错误
PL
Line to SMD Pin Spacing
走线与SMD元件脚太近
Line to Test Pin Spacing
走线与Test元件脚太近
Line to Through Pin Spacing
走线与Through元件脚太近
PP
SMD Pin to SMD Pin Spacing
SMD元件脚与SMD元件脚太近
SMD Pin to Test Pin Spacing
SMD元件脚与Test元件脚太近
Test Pin to Test Pin Spacing
Test元件脚与Test元件脚太近
Test Pin to Through Pin Spacing
Test元件脚与Through元件脚太近
Through Pin to SMD Pin Spacing
Through元件脚与SMD元件脚太近
Through Pin to Through Pin Spacing
Through元件脚与Through元件脚太近
PS
Shape to SMD Pin Spacing
Shape与SMD元件脚太近
Shape to Test Pin Spacing
Shape与Test元件脚太近
Through Pin to Shape Spacing
Through元件脚与Shape太近
PV
BBVia to SMD Pin Spacing
BBVia与SMD元件脚太近
BBVia to Test Pin Spacing
BBVia与Test元件脚太近
BBVia to Through Pin Spacing
BBVia 与Through元件脚太近
SMD Pin to Test Via Spacing
SMD Pin与Test Via太近
SMD Pin to Through Via Spacing
SMD Pin与Through Via太近
Test Pin to Test Via Spacing
Test Pin与Test Via太近
Test Pin to Through Via Spacing
Test Pin与Through Via太近
Test Via to Through Pin Spacing
Test Via与Through Pin太近
Through Pin to Through Via Spacing
Through Pin与Through Via太近
RC
Package to Hard Room
元件在其他的Room之内
RE
Min Length Route End Segment at 135Degree
无
Min Length Route End Segment at 45/90Degree
无
SB
135Degree Turn to Adjacent Crossing Distance
无
90Degree Turn to Adjacent Crossing Distance
无
SL
Min Length Wire Segment
无
Min Length Single Segment Wire
无
SN
Allow on Etch Subclass
允许在走线层上
SO
Segment Orientaion
无
BB
Bondpad to Bondpad
Bondpad之间的错误
SS
Shape to Shape
Shape之间的错误
TA
Max Turn Angle
无
VB
Via to Bondpad
Via 与Bondpad之间的错误
VG
Max BB Via Stagger Distance
同一段线的BB Via之间的距离太长
Min BB Via Gap
BB Via之间太近
Min BB Via Stagger Distance
同一段线的BB Via之间的距离太近
Pad/Pad Direct Connect
Pad 在另一个Pad 之上
VL
BB Via to Line Spacing
BB Via与走线太近
Line to Through Via Spacing
走线与Through Via太近
Line to Test Via Spacing
走线与Test Via太近
VS
BB Via to Shape Spacing
BB Via与Shape太近
Shape to Test Via Spacing
Shape 与Test Via太近
Shape to Through Via Spacing
Shape与Through Via太近
VV
BB Via to BB Via Spacing
BB Via之间太近
BB Via to Test Via Spacing
BB Via与Test Via太近
BB Via to Through Via Spacing
BB Via与Through Via太近
Test Via to Test Via Spacing
Test Via之间太近
Test Via to Through Via Spacing
Test Via与Through Via太近
Through Via to Through Via Spacing
Through Via之间太近
WA
Min Bonding Wire Length
Bonding Wire 长度太短
WE
Min End Segment Length
无
Min Length Wire End Segment at 135Degree
无
Min Length Wire End Segment at 45/90Degree
无
WI
Max Bonding Wire Length
Bonding Wire 长度太长
WW
Diagonal Wire to Diagonal Wire Spacing
斜线之间太近
Diagonal Wire to Orthogonal Wire Spacing
斜线与垂直/水平线之间的距离太近
Orthogonal Wire to Orthogonal Wire Spacing
垂直/水平线之间的距离太近
WX
Max Number of Crossing
无
Min Distance between Crossing
无
XB
135 Degree Turn to Adjacent Crossing Distance
无
90 Degree Turn to Adjacent Crossing Distance
无
XD
Externally Determined Violation
无
XS
Crossing to Adjacent Segment Distances
无
