package to package space 报错，求指点

我在画元器件封装时 没有画place bond_top,但是DRC检测验证的时候报错，元件间距太近（实际上不是很近，没关系），求大侠指点16.6如何设置，使这个不报错。
Constraint Name DRC Marker Location Required Value Actual Value Constraint Source Constraint Source Type Element 1 Element 2
Package to Package Spacing (537.000 1129.000) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "J11, Package Geometry/Place_Bound_Top" Filled Rectangle "J2, Package Geometry/Place_Bound_Top"
Package to Package Spacing (997.500 497.000) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "J3, Package Geometry/Place_Bound_Top" Filled Rectangle "T1, Package Geometry/Place_Bound_Top"
Package to Package Spacing (3515.169 1486.832) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "J9, Package Geometry/Place_Bound_Top" Filled Rectangle "J10, Package Geometry/Place_Bound_Top"
Package to Package Spacing (2369.000 886.000) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "U3, Package Geometry/Place_Bound_Top" Filled Rectangle "L3, Package Geometry/Place_Bound_Top"
Package to Package Spacing (2052.863 1560.500) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "R13, Package Geometry/Place_Bound_Top" Filled Rectangle "L2, Package Geometry/Place_Bound_Top"
Package to Package Spacing (3489.000 334.574) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "C47, Package Geometry/Place_Bound_Top" Filled Rectangle "Bt1, Package Geometry/Place_Bound_Top"
Package to Package Spacing (3307.000 153.000) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "D6, Package Geometry/Place_Bound_Top" Filled Rectangle "Jp6, Package Geometry/Place_Bound_Top"
Package to Package Spacing (796.000 1201.000) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "L7, Package Geometry/Place_Bound_Top" Filled Rectangle "J3, Package Geometry/Place_Bound_Top"
Package to Package Spacing (2810.863 1202.000) 0 MIL 150 MIL NONE DESIGN Shape "D24, Package Geometry/Place_Bound_Top" Filled Rectangle "L5, Package Geometry/Place_Bound_Top"
Package to Package Spacing (3305.264 351.029) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "C58, Package Geometry/Place_Bound_Top" Filled Rectangle "D6, Package Geometry/Place_Bound_Top"
Package to Package Spacing (-36.471 359.000) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "Sw2, Package Geometry/Place_Bound_Top" Filled Rectangle "J2, Package Geometry/Place_Bound_Top"
Package to Package Spacing (231.264 323.029) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "Sw2, Package Geometry/Place_Bound_Top" Filled Rectangle "D5, Package Geometry/Place_Bound_Top"
Package to Package Spacing (2889.000 2132.000) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "L6, Package Geometry/Place_Bound_Top" Filled Rectangle "U6, Package Geometry/Place_Bound_Top"
Package to Package Spacing (1414.937 1035.000) 0 MIL 150 MIL NONE DESIGN Filled Rectangle "R55, Package Geometry/Place_Bound_Top" Filled Rectangle "C13, Package Geometry/Place_Bound_Top"

没有place bond_top，软件会给一个默认的范围的，建议画上place bond_top

如图

哦，找到办法了，就是关掉这个

还是把PLACE_BOUND打开检查一下比较好

如果可以保证间距没问题，这个可以不用管。

间距确实没问题，而且画封装的时候也没有画place bond_top。所以关掉就好。

我关闭了package to package的开关，但是还是报错。这是怎么回事呢

好了，原来还有个DFA的开关，找了半天，

感谢分享！