倒出封装出现 *** being dumped问题

倒出封装出现 *** being dumped问题
一绘制好的＊．brd印制版－－(老版本绘制的，前用DB  Doctor工具打开)，从其中倒出其封状出现一系列ERROR:大致如下...................
** Creating padstacks. ***
  HOLE84 being dumped.
  TH2X2C being dumped.
  * being dumped.
ERROR:   creating padstack: *
  TH63X63 being dumped.
      ..................
  VIA being dumped.
  RECT110X84 being dumped.

  *** Creating package symbols (.dra and .psm) ***
  iccard being dumped.
  jumper2 being dumped.
  smd0805ok being dumped.
  dip1 being dumped.
  dip10 being dumped.

*********************** Summary *********************
ERRORs reported:                           1
Number of padstacks dumped:               46
Number of package symbols dumped:          5
Total number of symbols dumped:            5
此倒出的封装是否可用,大概不可用吧,要怎么修正下,才可以倒出正确的封撞?请高手帮忙指点,谢谢！

哪位大侠能抽出时间指教一下！

想知道。