A modeling problem in CST thermal solver

Hi,
I wanted to evaluate heat/temperature distribution on a ceramic substrate, bearing some MW integrated circuits, structures, and DC lines. The temperature distribution due to DC and MW signals can be seen with a MW and thermal co-simulation and looks fine to me.
The DC and MW signals pass through an IC. For the electrical model, this IC is represented as measured s2p file. The approximate dimensions of the chip, cavity, on-chip DC power dissipation and thermal conductivities of different materials are known. However, for the thermal model, if someone can comment how to represent this chip on a ceramic substrate, so that I can model the dynamic thermal distribution across the module. I want to use the scaled E-field from electrical model so that the real thermal distribution could be simulated.
regards,
Saqib Kaleem

Hi,
Did you solve your problem? I have similar problem: calculate themperature evolution of nanostructure after pulse excitation with laser. I can calculate stacionar thermal distribution for such problem, but transient thermal solver doesn't calculate a proper result.
Anton.

yes, my problem is solved. you have to be careful with the time-duration you allow the simulator to run. Therefore, use sufficiently large time span to allow heating and cooling e.g. use 60e9 for 1min real situation if your unit scale is set is nanosec.

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