CST2013 MWS Examples: Via Connection

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General Description

This example demonstrates the transient calculation of the scattering parameters of a microstrip via.

Structure Generation

The background material is defined as vacuum, the units are changed to millimeters, gigahertz and nanoseconds. Furthermore, the mesh settings are changed to account for the planar microstrip structure.

The substrate, the microstrip lines and the ground plane are created as boxes in the corresponding layers, and cylinders are used to define the rod, the landings and to cut a hole into the ground plane.

The upper distance to the boundary above the substrate is increased by five millimeters, and magnetic boundary conditions are defined.

Solver Setup

Two waveguide ports, each with one propagating mode, cover the lower or upper part of the boundary planes in z-direction, respectively.

The transient solver is started without altering the default settings.

Post Processing

The resulting time signals are automatically converted into the corresponding scattering parameters. They are listed in the navigation tree in the folder 1D Results and show the transmission behavior of the microstrip via. The electric and the magnetic field at 5 GHz can be found in the folder 2D/3D Results.