CST STUDIO SUITE 2012 Beta

上周末收到寄来的Beta光盘，今天收到Licence和2011的Service Pack，升级2011之后装上2012的测试版看看。

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软件：
软件的About：


在Update Manager里已经有了第一个Hotfix：


今天（10月21日）2012关闭之后再打开就一直报错，进Update Manager之后看到新的Hotfix，安装之后可以正常启动运行：

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操作：
MWS的主界面：


打开对话框有改变，Preview做在了右边，可以显示更多信息：


保存时DS标签的右边多了一个进度条：


又多试了试，这个功能应该是做成了和左下角的进度条对应：

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求解器：
Transient Solver Parameter主界面有小小改变，加了Mesh type选项：


Special...选项里的Solver选项卡有改变，以前的一些选项被集中在这里了：

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Job Control Centre：
Job Control Centre的选项也做了修改：


现在如果在Job Control Centre里添加相同的文件会给出提示：

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网格：
Local Mesh Properties里面多了Mesh Group功能，修改对话框中的参数将同时修改Group中所有Structure的对应参数。


单击Apply之后会给出提示信息：


运行求解器之后如果提示Staircase网格被填充为PEC，现在有一个More...链接：

单击链接会打开Mesh Problem Handling帮助文件：

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建模：
Histoty list右下角多了一个"More >>"按钮：


单击之后给出提示信息：


OK之后进入Expert mode：

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背景材料的对话框有改动：


单击Properties之后进入属性修改对话框，和Material Properties类似：

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材料属性：
“冷拉铜”这个材料现在改名为"Copper (Pure)"：

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本帖持续更新......

 

我晕，这更新的速度是不是太快了点。2012版本有什么大的改进呢？版主

 

抄几段10月份的E-newsletter：
System Assembly and Modeling
Complete Technology for EM simulation is one of the key strengths of CST STUDIO SUITE. Having access to a choice of available simulation methods allows the user to select the optimal solver for the simulation of a given component. CST STUDIO SUITE 2012 takes simulation a step further: System Assembly and Modeling (SAM) provides an environment that simplifies the management of simulation projects in many ways.
A device may consist of more than one component, each of which may require a different solution method for optimal simulation performance. The performance of such a large or complex system might be affected by interaction between components, so an optimization of the individual components might not be sufficient. An optimization of the entire system may be required. SAM provides a framework for addressing this requirement.
In SAM a system is described by a schematic. In the simplest case this is one block representing a parameterized 3D model. The user defines the evaluations for this model by setting up simulation tasks. SAM helps you to compare the results of different solvers or model configurations within one simulation project. The user can also set up a linked sequence of solver runs. For example, the electromagnetic analysis of a filter could be followed by a thermal simulation, then the filter’s resulting mechanical deformation could be determined, and finally this geometric change could be used in another electromagnetic simulation to investigate the detuning effect. All simulations and links can be defined easily in SAM to enable a seamless multiphysics work flow.
By adding other models to the schematic, the user can create a 3D system. SAM helps the user to define the geometric alignment of the various components. Simulation tasks can be defined that include single or multiple components and the user can specify which components should be simulated in 3D, and which solver and CST simulation acceleration options should be used for those simulations. Components could also be represented simply by their S-parameter behavior or by an equivalent field source in the system simulation. This combination of different levels of simulation helps to reduce the computational effort required to analyze a complex model accurately. If required, SAM naturally also enables the user to create and simulate their system in full 3D.
Beta Testing of CST STUDIO SUITE 2012
Preparation for the upcoming 2012 version of CST STUDIO SUITE is in full swing. This release will feature improvements and innovations in many areas. CST DESIGN STUDIO version 2012 will enable the set-up of nested task structures. A new tabular view allows the straightforward accessing, sorting and filtering of result data after a parameter sweep or an optimization.
The newly built-in component library enables access to components of various vendors, such as ON Semiconductor and STMicroelectronics. System Assembly and Modeling opens up new application areas. Existing modeling, solver and acceleration technology has been upgraded and improved in performance and usability.
Also important is a new SI workflow in CST PCB STUDIO and the fast IR drop simulation capability.
Beta testing of version 2012 for customers will start in a few weeks. Please contact your local CST support team if you would like to participate, we always appreciate your feedback. Shipment of the final release of CST STUDIO SUITE 2012 is scheduled for February / March 2012.
New multi-layer solver
CST MICROWAVE STUDIO version 2012 comes with a new multi-layer solver. This is a 3D planar electromagnetic solver for planar modeling and analysis. It is based on the Method of Moments (MoM) and enables users to simulate multi-layer geometries accurately and efficiently. The new solver features automatic layer stack generation from 3D models, automatic edge mesh refinement as well as automatic de-embedding of ports.
Typical applications are RF designs such as planar antennas and filters, as well as MMIC and planar feeding network designs. Accurate co-simulation of complex micro-strips and transmission lines in 2D is facilitated in CST STUDIO SUITE by CST DESIGN STUDIO. The new multi-layer solver makes this easier than ever, and together with CST's new System Assembly and Modeling (SAM), the new solver can be used to simulate planar components of complex systems even more efficiently.

 

又出来新版本了，我都还是用的2009呢。

 

2011才出的SP5估计还得出几个SP吧
结果这就2012了，不淡定了

 

怎么回事啊，2011都没装上！

 

还没用上2011啊( ⊙ o ⊙ )啊！

 

看那个2012的about里那个代表2012版本的绿图，我的感觉是似乎是2012版要对PCB有大发展啊。
EDATOP，我最关注的一个问题是，还有MS工作室吗？是否TLM已经彻底变成了MWS工作室的一个求解器了？

 

有。

 

那你看看CST 2011的光盘盒，上面已经没有MS了。
你再看看2012 Beta盒子上有没有了？
真搞不懂，到底还要不要MS了。

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